The service offerings from ISPL comprehend the entire semiconductor
value chain, from design and prototyping, to mass production and distribution
of our customers' products.
We provide a range of semiconductor services to support the initial
part of the product life-cycle - the design and prototyping phase.
The scope of our services includes:
- Packaging Solution
- Package Design & Development
- Thermal & Electrical Modeling
- Process Development
- Cost Effective Material Selection
- System In a Package (SIP)
- Test Solution
- Design For Test
- Test Program Development
- Test Program Conversion
- Test Flow Development
- Test Time Reduction
- Load Board & Probe Card Design
- Burn-In Board Design and Fabrication
- Burn-In Systems
- Prototyping
- Device Characterization
- Reliability Services
- Product & Package Failure Analysis
- PCB Assembly for Development Kit
- Quick Turn Assembly
We extend our services to the ramp-up phase of your product, offering
full turnkey capability, supporting from low to mid and high volume
production, and providing the option of delivering your product
to your customer's door-step. We further value add to this phase
in providing reliability and failure analysis support. The scope
of our services includes:
- Assembly
- Both Captive Lines and Open Lines
- From low volumes, quick turns to high volumes, standardized
processes
- From prototype to end-of life products
- Various materials - Silicon, GaAs, SAW
- Test (Memory, Mixed Signal & Logic)
- Electrical Test
- Burn-In
- Environmentals
- Failure Analysis
- Parametric electrical test
- Real-time X-ray
- Optical & C-mode scanning acoustic microscopy
- SEM/EDX
- Reliability
- Moisture sensitivity test
- High temperature treatment
- Temperature cycling treatment
- HAST
- Solderability test
- HTOL
- ESD (HBM/CDM/MM, latchup)
- End of Line Services
- Laser Marking
- Bake
- Scan
- Tape & Reel
- Warehousing & Logistics
- Packing
- Storage
- Drop-Shipment
|
