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| Leaded
Packages |
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PDIP, SOIC,FP, SOT 23/29, SC 79, TQFP |
| Ceramics
Packages |
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CDIP, SB,CLCC, CPGA, CerQUAD, CQFP, Pre-JLDCC |
| Multi-Chip
Packages |
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Silicon Chip Stack
Die, Multi-Chip Passives (RLC), Multi-Chip ceramic interposer,
Multi-Chip LTCC substrate, Multi-Chip Passives FR4 substrates |
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| Mixed
Packages |
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a. MEMS Silicon Chip Passives
b. GaAs Chip Potting (IRDA)
c. Metal Can Opto Devic
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