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  IS Test Lab is a 24/7 operation, providing local pick-up and delivery at no extra cost to our customers. There are two locations to serve you. The first in Santa Clara, California, and the second in Austin, Texas. We provide the following services:
Electrical Test and Wafer Sort
  • Multiple Tester platforms for Production and Engineering Services
  • State-of-the-Art Handlers with built in scanners - Ambient and hot temperature range
  • Test capabilities: Micro Controllers, FPGA's, PLD's, Graphics, Asics, Digital, Mixed Signal and RF Devices
  • Package Types Include: PLCC, SO, QFP, TSSOP, BGA, SOIC, CSP, DIP, QFN, SOJ, MLF


Production & Reliability Burn-In
  • Burn-In setup for new devices
  • Engineering and Custom Design and setup of Burn-In/Environmental Services, Burn-In Board Design and Layout Services
  • Static/Dynamic Burn-In - HTOL (High Temperature Operating Life)
  • Life Tests (1000 hours) Burn-In with multiple-pulls
  • Burn-In on Reliability and Qualification lots
  • In House Burn-In Board Test & Calibration


Environmental Tests
  • HAST (Highly Accelerated Stress Test)
  • Temperature Cycle
  • 85/85 THB (Temperature, Humidity, Biased Test)
  • LTOL (Low Temperature Operating Life)
  • IR-Reflow
  • Autoclave
  • Solderability
  • Liquid-to-Liquid Thermal Shock
  • HTS (High Temperature Storage Life)


Back End Services
  • Marking
    In-house Plate Making capability, coupled with the latest in pad printing tube and tray markers for rapid processing of customer products. We support both smaller engineering lots and larger production volumes.
  • Tape & Reel
    We offer tray-to-tape and tube-to-tape SMD Taping. Our services are enhanced by capability in Bake, Dry Pack and Lead Scan – for both trays and tubes.
  • Lead Scan
    We provide RVSI 3700 3D Laser Scanning, an Atrium Pick & Place Handler, In-Tray scanning, as well as QFP, TSOP, PLCC & BGA Software Packages. User programming, yield & tray reports per slot, tray maps, and device graphics features are also available.
  • Bake and Dry Pack
  • Lead Conditioning
    We offer lead conditioning for various QFP, PLCC, SOJ, SSOP, TSOP, TSSOP, and SOIC package types.


Engineering Development Services
  • Design For Test
  • Test Program Development
  • Test Program Conversion
  • Test Flow Development
  • Test Time Reduction
  • Load Board & Probe Card Design
  • Device Characterization

For additional information or a complete list of our capabilities list, please contact us.
 
 
 
  IS Test Lab delivering testing and engineering solutions for semiconductor industry
 

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