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  Electrical Test and Wafer Sort

To support our testing services, our facility provides the following:

Test Platforms :
  • Agilent – 93000 (digital & mixed signal)
  • Teradyne – Catalyst, Catalyst (RF), J750, Integra Flex
  • Credence – Duo, DuoSX, Quartet, LT Vista Vision,
                     NP Sapphire, ASL 3000RF
  • Nextest – Maverick
Handlers :
  • Seiko Epson - NS6040/6000, HM3000/HM3500
  • Synax 1211
  • Hyac 824/2655
  • Multi-test 8704r
  • ASECO
  • JLSI 8653D
  • MCT 4600/4610
  • MT8704 IHF
Prober :
  • TSK UF 200 Wafer Prober


Production & Reliability Burn-In

Our Burn-In service is Military & Commercial Burn-In - DSCC Certified, and is supported with:
  • 7056DC Dynamic Systems
  • 26/52/92 Signal & Multi-zone Programmable
  • Board test stations providing engineering support
  • Computer controlled real time scan, monitoring and logging control
  • Voltage and Current read-back features per slot
  • 12K/CV Compatible With N2
  • Graphical Pattern Editor ( PATED ) for complex burn-in
  • PATED Generated Stimulus Patterns for Digital & Analog Circuits, including Memories
  • Test vectors that can be downloaded in ASCII format to any tester & converted to run on ADEC Burn-In Chambers


Environmental Tests

The capabilities achieved and standards adhered to for our environmental tests are as follows:
  • The pattern editor capability includes –
    • 128K deep vector deep standard expandable to 1MB deep
    • Patterns downloadable through PC to the On-Board SRAM's.
    • Repeat count, RZ/NRZ, Tristate, Looping, and Initialization.
  • HAST - JEDEC Specification A110 test capability. DESPATCH HAST, Express TEST and 4 Hirayama Style Board Compatible, and 10 Slots per/cycle
  • Temperature Cycle - JEDEC Specification A104-A Test Capability.
  • 85/85 - Computer controlled Static & Dynamic THB capabilities. Real-Time Lot/Slot scanning & tracking. 26 - 52 channel zone configuration systems. On-Board fault monitoring and data logging. Blue-M 85/85 Static/Dynamic test system. Tenny Y20RC 85/85 Static/Dynamic.
  • LTOL -  -65 C to -100 C with dry N2 purge. 12K - AEHR, CV - Reliability, AMT, KES systems compatibility. Tenny T14 LTOL Dynamic chamber.
  • IR Reflow - Preconditioning of plastic mount Devices, utilizing JEDEC Specification A113-B test capability, or according to customer specifications.
  • Autoclave - Accelerated Moisture Resistant Test utilizing an Unbiased Autoclave Pressure Pot Test. JEDEC Specification A102-B Test Capability.
  • Solderability - JEDEC Specification B102-C Test Capability.
  • Liquid-to-Liquid Thermal Shock - JEDEC Specification A106-A Test Capability.

For additional information or a complete list of our capabilities list, please contact us.
 
 
 
  IS Test Lab delivering testing and engineering solutions for semiconductor industry
 

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