|
|
|
Originally conceived as a supplier of dedicated and custom production lines, ISPL has developed the traditional “open” subcon approach and is a supplier of numerous JEDEC compliant IC packages such as SOIC, PDIP, and the advanced sawn QFN/DFN package family.
|
|
Our new High density QFN leadframe allows us to compete as a world class supplier of Quad Flat
Nolead (QFN) and Thin Quad Flat Nolead (TQFN) packages for the IC industry.
Our engineering team provides expertise in a wide variety of packaging concepts with a strong base of world class manufacturing and quality tools.
 |
 |
Multi-Chip Packages
 |
 |
 |
Silicon Chip Stack Die, Multi-Chip Passives (RLC),
Multi-Chip ceramic interposer, Multi-Chip LTCC substrate,
Multi-Chip Passives FR4 substrates |
|
|
Mixed Packages
 |
 MEMS Silicon Chip Passives
GaAs Chip Potting (IRDA)
Metal Can Opto Devic |
 |
 |
 |
|
|
|
|
|
