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Plastic Package portfolio (open line):
Integrated circuit packaging services for JEDEC style IC packages. Our customers are often large semiconductor companies who send us their wafers for assembly on our open line. We offer a variety of conventional packages from sot23 and Small Outline IC (soic) up to advanced packages like sawn QFN/DFN . |
Production test services:
Both before and after assembly, many of our customers require either wafer probe (sort) or final test services. This typically involves utilizing our automatic test equipment (ATE) such as testers buil by Eagle , Credence, or Teradyne.. Handlers include advanced models of Seiko Epson, Multitest, and SRM. Wafer sort services up to 8” on TSK wafer probers
Packing / TnR / drop ship services:
A full compliment of tape and reel or other special and custom packing services are available for products which are completed and fuly tested. We can pack these product according to our partners requirement and specification for drop ship directly to their end customers.
Dedicated production lines:
Many of our manufacturing partners (customers) have special package or design concepts, such as might be used for MEM’s or custom modules on pc board, or ceramic substrates. These products are often accomplished via specialized consigned equipment from our manufacturing partners coupled with our experience in packaging technology and volume production capability
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